Description: Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging. In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible.
Price: 139.99 USD
Location: Nepean, Ontario
End Time: 2024-11-12T14:58:24.000Z
Shipping Cost: 12 USD
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Item Specifics
All returns accepted: ReturnsNotAccepted
Subject: Design
Publication Name: Thermal Design of Electronic Equipment
Item Length: 9.3in.
Publisher: CRC Press LLC
Publication Year: 2000
Series: Electronics Handbook Ser.
Type: Textbook
Format: Hardcover
Language: English
Item Height: 0.9in.
Author: Ralph Remsburg
Item Width: 6.1in.
Item Weight: 26.3 Oz
Number of Pages: 372
