Thermal Adhesive Tape 25m X 10mm X 020mm Double Side Thermal Tapes Cooling Heat

Description: thermal adhesive Pad With Thermal conductivity, strong stickiness, softness, Insulation, Non-conductive, wear-resistant. fire-retardant, compression, buffering, no damage to metal materials, etc features, Can fill the uneven surface, be tightly and firmly fit the heat source devices and heat sink. Has strong adhesive strength, effectively replace the grease and mechanical fixation,A large number of applications in the bonding heat sink to the microprocessor and other power consumption of the semiconductor. Applicable industry: 1. LED industry, automotive electronics industry, power industry, PDP/LED flat-panel TV. 2. communications industry, Industrial industry, household electrical appliance industry. Widely Applied: electronic products, motherboard, motor, external pad and foot pad, electronic, appliances,high power LED lighting,Car machine, power devices, automotive electronic modules (engine scrubber) . Power Modules: high power power supplies, computer host (CPU, GPU, USICS, RDRAMTM, CD-ROM, IGPT module, hard drives) ,laptop and any electronic equipment needing to be filled with heat dissipation. Features: Thermal conductivity and high stability, its life than the general heat double-sided stickers long, normal temperature (30~+150 °C ) can work for a minimum of 5 years. Specification: Dimension: 10mm x 25m (Width x Length) Glass fiber thickness: 0.2mm Thermal Conductivity: 2W/m-k Breakdown Voltage: 5KVAC Thermal impedance : 0.3℃in2/w Initial Adhesion: 1.5kg/inch Package included: 1 Roll 25mx10mmx0.2mm Thermal Tape ❀ Thermal Adhesive Tape is a simple and practical tape, easy to install, easy to use, easy to eliminate. ❀ Thermal tape with the high thermal conductivity, insulation, strong stickiness, softness, compression. ❀ EFFICIENT THERMAL CONDUCTIVITY - The Thermal Pad based on silicone & a special filler outperforms generic and performance pads by far. The Thermal Conductivity amounts to 2.0 W/mK. ❀ Thermal tape with the high thermal conductivity, insulation, strong stickiness, softness, compression. ✔Widely used in most electronic devices,High tensile strength and strong adhesion hold the device firmly in place, to achieve the most effective thermal dissipation ❀ Used for fill the uneven surface,Can be tightly and firmly fit the heat source devices and heat sink,heat sink and IC chip bonding, high power LED and heat aluminum bonding.

Price: 10.09 USD

Location: Los Angeles, California

End Time: 2024-11-06T11:24:18.000Z

Shipping Cost: 0 USD