Description: Rf and Microwave Microelectronics Packaging, Paperback by Kuang, Ken (EDT); Kim, Franklin (EDT); Cahill, Sean S. (EDT), ISBN 1489983244, ISBN-13 9781489983244, Brand New, Free P&P in the UK RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Price: 125.99 GBP
Location: Castle Donington
End Time: 2024-12-13T10:14:59.000Z
Shipping Cost: 20.28 GBP
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Book Title: Rf and Microwave Microelectronics Packaging
Number of Pages: 285 Pages
Language: English
Publication Name: Rf and Microwave Microelectronics Packaging
Publisher: Springer-Verlag New York Inc.
Publication Year: 2014
Subject: Engineering & Technology, Physics
Item Height: 235 mm
Item Weight: 468 g
Type: Textbook
Author: Ken Kuang, Franklin Kim, Sean S. Cahill
Subject Area: Manufacturing Engineering
Item Width: 155 mm
Format: Paperback
