Description: Rf and Microwave Microelectronics Packaging, Paperback by Kuang, Ken (EDT); Kim, Franklin (EDT); Cahill, Sean S. (EDT), ISBN 1489983244, ISBN-13 9781489983244, Brand New, Free shipping in the US RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Price: 174.54 USD
Location: Jessup, Maryland
End Time: 2024-12-24T19:05:21.000Z
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Book Title: Rf and Microwave Microelectronics Packaging
Number of Pages: Xvi, 285 Pages
Publication Name: RF and Microwave Microelectronics Packaging
Language: English
Publisher: Springer
Subject: Electronics / Microelectronics, Telecommunications, Electronics / General, Microwaves
Publication Year: 2014
Item Weight: 16.5 Oz
Type: Textbook
Item Length: 9.3 in
Subject Area: Technology & Engineering
Author: Franklin Kim
Item Width: 6.1 in
Format: Trade Paperback
