Description: RF and Microwave Microelectronics Packaging II Please note: this item is printed on demand and will take extra time before it can be dispatched to you (up to 20 working days). Author(s): Ken Kuang, Rick Sturdivant Format: Hardback Publisher: Springer International Publishing AG, Switzerland Imprint: Springer International Publishing AG ISBN-13: 9783319516967, 978-3319516967 Synopsis This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" [tel] and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Price: 88.01 GBP
Location: Aldershot
End Time: 2024-02-04T09:07:50.000Z
Shipping Cost: 37.33 GBP
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Book Title: RF and Microwave Microelectronics Packaging II
Subject Area: Manufacturing Engineering
Item Height: 235mm
Item Width: 155mm
Author: Ken Kuang, Rick Sturdivant
Publication Name: Rf and Microwave Microelectronics Packaging Ii
Format: Hardcover
Language: English
Publisher: Springer International Publishing A&G
Subject: Engineering & Technology, Physics
Publication Year: 2017
Type: Textbook
Item Weight: 4085g
Number of Pages: 172 Pages
