Description: Quality Conformance and Qualification of Microelectronic Packages and Interconnects by Abhijit Dasgupta, John W. Evans, Jillian Y. Evans, Michael G. Pecht Estimated delivery 3-12 business days Format Paperback Condition Brand New Description All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost--effective products should know that the paradigm has shifted. Publisher Description All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that dont cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This books groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in todays high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbooks guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp. Author Biography DR. MICHAEL G. PECHT is a tenured faculty member with a joint appointment in Systems Research and Mechanical Engineering, and the Director of the CALCE Electronic Packaging Research Center at the University of Maryland. He has an MS in electrical engineering and an MS and PhD in engineering mechanics from the University of Wisconsin. He is a Professional Engineer and an IEEE Fellow. He serves on the board of advisors for various companies and was a Westinghouse Professor. He is the chief editor of the IEEE Transactions on Reliability, on the board of advisors for IEEE Spectrum, and a section editor for the Society of Automotive Engineering. DR. ABHIJIT DASGUPTA is a tenured faculty member with the CALCE Electronic Packaging Research Center at the University of Maryland. DR. JOHN W. EVANS is a program manager of the Electronic Packaging Program for NASA Headquarters in Washington, D.C. JILLIAN Y. EVANS is an aerospace engineer at the NASA Goddard Space Flight Center Facility in Greenbelt, Maryland. Details ISBN 0471594369 ISBN-13 9780471594369 Title Quality Conformance and Qualification of Microelectronic Packages and Interconnects Author Abhijit Dasgupta, John W. Evans, Jillian Y. Evans, Michael G. Pecht Format Paperback Year 1995 Pages 496 Edition 1st Publisher John Wiley & Sons Inc GE_Item_ID:151641029; About Us Grand Eagle Retail is the ideal place for all your shopping needs! With fast shipping, low prices, friendly service and over 1,000,000 in stock items - you're bound to find what you want, at a price you'll love! Shipping & Delivery Times Shipping is FREE to any address in USA. Please view eBay estimated delivery times at the top of the listing. Deliveries are made by either USPS or Courier. We are unable to deliver faster than stated. International deliveries will take 1-6 weeks. NOTE: We are unable to offer combined shipping for multiple items purchased. This is because our items are shipped from different locations. Returns If you wish to return an item, please consult our Returns Policy as below: Please contact Customer Services and request "Return Authorisation" before you send your item back to us. Unauthorised returns will not be accepted. Returns must be postmarked within 4 business days of authorisation and must be in resellable condition. Returns are shipped at the customer's risk. We cannot take responsibility for items which are lost or damaged in transit. For purchases where a shipping charge was paid, there will be no refund of the original shipping charge. Additional Questions If you have any questions please feel free to Contact Us. Categories Baby Books Electronics Fashion Games Health & Beauty Home, Garden & Pets Movies Music Sports & Outdoors Toys
Price: 186.37 USD
Location: Fairfield, Ohio
End Time: 2025-02-02T03:44:05.000Z
Shipping Cost: 0 USD
Product Images
Item Specifics
Restocking Fee: No
Return shipping will be paid by: Buyer
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
ISBN-13: 9780471594369
Book Title: Quality Conformance and Qualification of Microelectronic Packages
Number of Pages: 496 Pages
Language: English
Publication Name: Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Publisher: Wiley & Sons, Incorporated, John
Item Height: 1.2 in
Publication Year: 1994
Subject: Industrial Design / Packaging, Electronics / General, Quality Control
Type: Textbook
Item Weight: 31.3 Oz
Author: Abhijit Dasgupta
Subject Area: Technology & Engineering
Item Length: 9.3 in
Item Width: 6.1 in
Format: Trade Paperback
