Description: Physics and Fabrication of Microstructures and Microdevices : Proceedings of the Winter School Les Houches, France, March 25 - April 5, 1986, Paperback by Kelly, Michael J. (EDT); Weisbuch, Claude (EDT), ISBN 364271448X, ISBN-13 9783642714481, Brand New, Free shipping in the US les Houches This Winter School on "The Physics and Fabrication of Microstructures" originated with a European industrial decision to investigate in some detail the potential of custom-designed microstructures for new devices. Beginning in 1985, GEC and THOMSON started a collaboration on these subjects, supported by an ESPRIT grant from the Commission of the European Com munity. To the outside observer of the whole field, it appears clear that the world effort is very largely based in the United States and Japan. It also appears that cooperation and dissemination of results are very well organised outside Europe and act as a major influence on the development of new concepts and devices. In Japan, a main research programme of the Research and Development for Basic Technology for Future Industries is focused on "Future Electron Devices". In Japan and in the United States, many workshops are organised annually in order to bring together the major specialists in industry and academia, allowing fast dissemination of advances and contacts for setting up cooperative efforts.
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Book Title: Physics and Fabrication of Microstructures and Microdevices : Pro
Number of Pages: Xii, 472 Pages
Language: English
Publication Name: Physics and Fabrication of Microstructures and Microdevices : Proceedings of the Winter School les Houches, France, March 25-April 5 1986
Publisher: Springer Berlin / Heidelberg
Publication Year: 2011
Item Height: 0.4 in
Subject: Electronics / Semiconductors, Materials Science / Thin Films, Surfaces & Interfaces, Electronics / Circuits / Vlsi & Ulsi, Electronics / General, Materials Science / Electronic Materials
Item Weight: 29.4 Oz
Type: Textbook
Author: Claude Weisbuch
Item Length: 9.6 in
Subject Area: Technology & Engineering
Item Width: 6.7 in
Series: Springer Proceedings in Physics Ser.
Format: Trade Paperback