Description: Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System Please note: this item is printed on demand and will take extra time before it can be dispatched to you (up to 20 working days). Author(s): Seiji Samukawa Format: Paperback Publisher: Springer Verlag, Japan, Japan Imprint: Springer Verlag, Japan ISBN-13: 9784431547945, 978-4431547945 Synopsis This book provides for the first time a good understanding of the etching profile technologies that do not disturb the plasma. Three types of sensors are introduced: on-wafer UV sensors, on-wafer charge-up sensors and on-wafer sheath-shape sensors in the plasma processing and prediction system of real etching profiles based on monitoring data. Readers are made familiar with these sensors, which can measure real plasma process surface conditions such as defect generations due to UV-irradiation, ion flight direction due to charge-up voltage in high-aspect ratio structures and ion sheath conditions at the plasma/surface interface. The plasma etching profile realistically predicted by a computer simulation based on output data from these sensors is described.
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Book Title: Feature Profile Evolution in Plasma Processing Using On-wafer ...
Number of Pages: 40 Pages
Language: English
Publication Name: Feature Profile Evolution in Plasma Processing Using On-Wafer Monitoring System
Publisher: Springer Verlag, Japan
Publication Year: 2014
Subject: Engineering & Technology, Physics
Item Height: 235 mm
Item Weight: 949 g
Type: Textbook
Author: Seiji Samukawa
Subject Area: Material Science, Nanotechnology
Series: Springerbriefs in Applied Sciences and Technology
Item Width: 155 mm
Format: Paperback
