Description: Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)by Keser, Beth; Kröhnert, Steffen Description: It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.Product ID: 1119793777-8-1
Price: 184.04 USD
Location: Philadelphia, Pennsylvania
End Time: 2025-01-12T17:29:42.000Z
Shipping Cost: 0 USD
Product Images
Item Specifics
Return shipping will be paid by: Seller
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Return policy details:
Book Title: Embedded and Fan-Out Wafer and Panel Level Packaging Technologies
Number of Pages: 320 Pages
Language: English
Publication Name: Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces : High Performance Compute and System-In-Package
Publisher: Wiley & Sons, Incorporated, John
Subject: Engineering (General), Industrial Design / Packaging, Electronics / Semiconductors, Electronics / Microelectronics
Item Height: 0.4 in
Publication Year: 2021
Type: Textbook
Item Weight: 16 Oz
Item Length: 0.4 in
Subject Area: Technology & Engineering
Author: Steffen Kröhnert
Series: IEEE Press Ser.
Item Width: 0.4 in
Format: Hardcover
